](https://www.bbc.com/news/technology-62319149)
The article delves into the technology behind AMD's MI300, a high-performance computing processor designed for AI and HPC applications. The MI300 features a unique 3D stacked design, with multiple dies connected by through-silicon vias (TSVs) and a hybrid architecture that combines CPU, GPU, and FPGA capabilities. This design enables high-bandwidth, low-latency communication between components and allows for the integration of multiple processing units.
The MI300's 3D stacked design is particularly noteworthy, as it allows for a significant increase in transistor density and a reduction in power consumption. The use of TSVs enables the connection of multiple dies without the need for traditional wire bonding, reducing the overall size and weight of the processor.
The hybrid architecture of the MI300 is also a key feature, allowing it to tackle a wide range of workloads from traditional HPC applications to AI and machine learning tasks. The processor's FPGA capabilities enable it to be reconfigured for specific tasks, making it a versatile tool for a variety of applications.
The MI300's performance and power efficiency make it an attractive option for organizations looking to upgrade their HPC infrastructure. Its ability to handle complex workloads and its compact design make it an ideal choice for data centers and other high-performance computing environments.
In conclusion, AMD's MI300 is a significant innovation in high-performance computing, offering a unique combination of performance, power efficiency, and versatility. Its 3D stacked design and hybrid architecture make it an attractive option for organizations looking to upgrade their HPC infrastructure and tackle complex workloads.
**Current Event Relevance:**
* The MI300's focus on AI and HPC applications makes it relevant to the current trend of increasing adoption of AI in various industries.
* The processor's high-performance capabilities and power efficiency make it an attractive option for organizations looking to upgrade their HPC infrastructure, which is a growing concern in the current technological landscape.
* The MI300's compact design and reconfigurable FPGA capabilities make it an ideal choice for data centers and other high-performance computing environments, which are becoming increasingly important in the current era of digital transformation.](https://www.bbc.com/news/technology-62319149)
The article provides a detailed analysis of the technology behind AMD's MI300, highlighting its unique features and benefits. The relevance of the MI300 to current events is also discussed, emphasizing its
23 Comments
Do you think all five technologies will "trickle down" into the consumer market? Will we buy a single "gaming SoC" at some point in the future?
AMD is way ahead of the curve vs the competition. They just need someone to market the tech better. They are a true heterogenious system and get better and better every year. Now AMD is sharing GDDR with CPU / GPU and other AI accelerators.
The transition to GAAFET/MBCFET in near future process nodes like 18A strongly indicates that process will still prove to be a driving factor in performance. Despite TSMC still using FINFET for 3nm, GAA may be feasible in sub-nanometer
MI300? More like "Magnificent technology, and they're going way ahead!" 👍
can't wait to find out if this thing runs doom
BUT THE ETERNAL QUESTION REMAINS UNANSWERED…
CAN IT RUN DOOM
Bapak Pamudji id
This is so cool. I want this for my home lab.
They are using atomera's mst
2:00
"Apple has been a pioneer in this area…"
No, no they have not. They licensed ARM just like thousands of companies before. If they had integrated RISC-V, maybe you would have a point.
What about Chromebooks? Many of those run on SOCs and they have been around for many years.
Is somebody who shows up at some point after all technologies exist a pioneer? Damn, I should do some pioneering.
I want one but I'll never be able to afford it
Such a great channel & amazing video explanation. Even big youtubers like linus tech tips don't explain chip design like this. Very underrated channel.
Intel's PVC GPUs have 16 compute tiles sitting on top of a base layer that has sram cache.
Fantastic breakdown High Yield. Wow!!
Imagine all the performance we're gonna get once AI calms down and all this tech comes to consumer hardware
I don't know if you are still reading comments from a video a year ago, but here's are mine.
First, nice job showing how the chiplets are stacked up. I haven't seen another presentation of the stacking that is clear. At all.
The claim is that interposers and chiplets reduce power. Okay, prove it.
* For a signal travelling, say, 5 cm, how many picojoules per bit are consumed pushing that signal across metal on the interposer, versus how many picojoules per bit are consumed pushing that signal through a short-range serdes, across a lower-capacitance organic composite substrate, and then back up into another serdes?
* From that energy cost, and the stated bandwidths that these chips have, you can figure out the power dissipation in the communications system. Is it 10% of the total power budget, or 50%?
Thanos comparison was 😂😂😂
fk nvidia and apple, shtty monopolizaiton practices they wanna own the world
UMA makes data access faster (lower latency) as well as more efficient. Managing caches and external memory access was a huge burden for traditional multi-processors.
#6 different ai chips for different porpuses
When will AMD sell these for the gaming PC market or is this the next Play Station?
waste of tim. trivia and very little substance.
Are Nvidia and Apple the last big bastions of huge monolithic chips? Both of those companies seem to have the same attitude to throw money on the problem and let the consumer pay for it. Nvidia and their maxing out chip size for each node. Apple M3 with 3 different design chips reported to cost 1 billion dollars to make. Why did Apple not release a 4-chip M ultra-ultra chip as was rumored for the Mac Pro replacement? Pro machines with 192gig memory are a no-go for many IT pros. (and 256 does not solve it either. 4 chips would at least bump it up to 512 compared to Intels MacPro with 1.5 terra)